01
CAD & Modeling
Drawings, samples, measurements, interface details, and functional requirements can be developed into a controlled manufacturing definition.
Capture the full requirement
Critical dimensions, tolerances, materials, finishes, and revision control should be established before production.
02
Precision Machining
Machining options may include complex multi-axis work and tight-tolerance components for semiconductor equipment applications.
Manufacturability review
Geometry, tolerance stack-up, material behavior, quantity, inspection needs, and cost influence the manufacturing approach.
03
Cutting & Welding
Water jet, laser cutting, TIG, MIG, and laser welding may support frames, brackets, panels, enclosures, fixtures, and equipment modifications.
Process selected by application
Material thickness, heat input, distortion, cleanliness, strength, and finish requirements guide process selection.
04
Finishing & Coatings
Potential finishing paths include electrostatic discharge coating, electroplating, powder coating, anodizing, and other application-specific treatments.
Consider the fab environment
Chemical exposure, vacuum compatibility, conductivity, corrosion, wear, cleanliness, and appearance requirements should be documented.